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──Aug 28, 2019Split type fan-free computer heat dissipation device

as we all know, the noise emitted by the computer mainframe is very annoying, so people have developed a variety of products to reduce the noise pollution sources of CPU and power fans. There are basically three ways:

1, increase the fan diameter, ensure air flow, reduce the speed;

2, with water cooling device instead of fan cooling;

3, to heat the main body such as CPU and graphics card with better thermal conductivity of materials, increase the heat dissipation area, in addition to make thick steel plate on the chassis and increase its integrity, in order to reduce resonance and other products.

enough fan ventilation can be applied; As for the method of adding sound deadening layer and thickened steel plate to the chassis, the sound reducing effect is very little. In short, whether it is a "water cooling head" radiator or a "fan-free" radiator, its fixed connection mode is used for inspection and maintenance , replacement and cleaning of internal parts bring inconvenience, complicated structure, various materials and processes, high processing cost, and influence on surrounding heat dissipation, so satisfactory results have not been achieved. However, the "water-cooled head" radiator is not widely used because of its liquid leakage.

the purpose of this paper is to overcome the shortcomings of the above-mentioned prior art, and to provide a split fan-free computer cooling device, which mainly solves the problems of the existing computer noise and its complicated structure.

in order to achieve the above objectives, this paper is implemented as follows:the split fan-free computer heat dissipation device is characterized in that it comprises a heat dissipation body 2, on which a computer heat dissipation element mounting and fixing position 3 is arranged, which can be installed inside or outside the machine.

this paper's split fan-free computer heat sink, the heat sink 2 is provided with a chassis shell 1, which can be left shell, right shell, left shell and right shell simultaneously, thus forming a perfect whole with the chassis.

the split fan-free computer heat dissipation device in this paper is characterized in that a coil pipe 5 is arranged between a case shell 1 and a heat dissipation body 2, the coil pipe 5 is connected with an oil pump through an oil pump interface 8, a liquid storage tank 6 is arranged on the case shell 1 at the top of the coil pipe 5, a leakage-proof drainage groove 7 is arranged at the bottom of the case shell 1, and a leakage-proof drainage groove 7 is arranged at A ventilation window 9 is arranged on the case shell 1.The case shell 1 can be either a left shell or a right shell, or the left shell and the right shell can be used in series through a coil pipe 5 so as to form a complete whole with the case.

for the split fan-free computer radiator described herein, the coil 5 is preferably s-shaped:the coil 5 can be arranged on the coil plate 4.

in the split fan-free computer cooling device described in this paper, the cooling body 2 is externally provided with cooling fins 13, which are generally used in the chassis.

this paper's split fan-free computer radiator, the radiator 2 is internally provided with a partition board 10, a top cover 11 is arranged on the top of the radiator 2, and a liquid injection port or a head cover 12 is arranged on the top cover 11; The partition plate 10 is provided with a fan-type oil pump 14.

compared with the prior art, the split fan-free computer heat dissipation device described in this paper has outstanding substantive features and significant progress:

1.due to the adoption of split type, other components on the main board are no longer affected by heat sources such as CPU, and the heat generating components are concentrated, thus making the heat dissipation more reasonable.

2, small volume, simple structure, easy processing and low cost;

3.it can be hung in any open place in the cabinet to make the layout in the cabinet reasonable and even fixed outside the cabinet to facilitate heat dissipation.

4, reduce the resonance in the box, the system work more stable;

5, no liquid leakage concerns.